Contactless End-Effectors

The contactless end-effectors (mCL series) are designed for contactless chip side & back side handling of thin and warped wafers, e.g. out of and into a cassette.

Types according to wafer size:

  •  150 mm / 6” (end-effector mCL 150)
  •  200 mm / 8” (end-effector mCL 200)
  •  300 mm / 12” (end-effector mCL 300)

★Function:

The contactless end-effectors use only Bernoulli airflow (no vacuum). The wafer is hovering on the air cushion 0.2 - 0.3 mm above or below the end-effector and is limited sideways by PEEK-elements.
This end-effector does not require the wafer to be fully planarized. Even warped wafers which are too stiff for other systems can be handled.

★Featues:

  • Wafer sizes: 150 mm (6”), 200 mm (8”), 300 mm (12”)
  • For thin-wafers > 50 µm (2 mil)
  • Warped wafer handling (up to 12 mm warpage)
  • Chip side and back side handling
  • Contacless handling with Bernoulli airflow
  • Wafer detection with capacitive sensing
  • Automated quick coupling
  • Automated loading and unloading of several mechatronic components
  • Antistatic surface

 

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