Packing Tool mPT 150/200
The Packing Tool mPT 150/200 is designed for packing and unpacking of 150 mm (6”) and 200 mm (8”) wafers by using contactless end-effectors (mCL series).
The mPT 150/200 comes with a dual-arm-robot, contactless end-effectors for 6"/8" wafers, wafer flipping function, two cassette stations with scanner for 6"/8" cassettes, a pre-aligner, a packing chuck and a packing module containing five stations for shipping boxes and packing material, as well as a touch screen. Optionally it can be equipped with a green light visual inspection module.
- Wafer sizes: 150 mm (6”) and 200 mm (8”)
- Packing and unpacking of e.g. thin-wafers
- Handling of warped wafers
- Optimized footprint
- High throughput
- Cassette scanning
- Green light visual inspection optional
- OCR reader for wafer ID optional
- FFU for better cleanroom class optional
- Cleanroom class 6 (ISO EN 14 644-1)
- CE certificated
- SEMI standard compliant
- UPS (uninterruptible power supply) optional