Packing Tool mPT 150/200

The Packing Tool mPT 150/200 is designed for packing and unpacking of 150 mm (6”) and 200 mm (8”) wafers by using contactless end-effectors (mCL series).

The mPT 150/200 comes with a dual-arm-robot, contactless end-effectors for 6"/8" wafers, wafer flipping function, two cassette stations with scanner for 6"/8" cassettes, a pre-aligner, a packing chuck and a packing module containing five stations for shipping boxes and packing material, as well as a touch screen. Optionally it can be equipped with a green light visual inspection module.

Features:

  • Wafer sizes: 150 mm (6”) and 200 mm (8”)
  • Packing and unpacking of e.g. thin-wafers
  • Handling of warped wafers
  • Optimized footprint
  • High throughput
  • Cassette scanning
  • Green light visual inspection optional
  • OCR reader for wafer ID optional
  • FFU for better cleanroom class optional
  • Cleanroom class 6 (ISO EN 14 644-1)
  • CE certificated
  • SEMI standard compliant
  • UPS (uninterruptible power supply) optional

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