Top Grip End-Effectors

The top grip end-effectors (mTG series) are designed for chip side handling of thin and warped wafers e.g. for handling from a pre-aligner onto a process chuck or onto an inspection table.

Types according to wafer size:

  • 150 mm / 6” (end-effector mTG 150)
  • 200 mm / 8” (end-effector mTG 200)
  • 300 mm / 12" (end-effector mTG 300)

Fnction:

By using Bernoulli airflow the wafer is only touched at the edge exclusion area at the front side, the process area is safe. They enable direct handling onto a process chuck and do not require lift pins or an aperture for standard vacuum end-effectors.

The 200 mm top grip end-effector comes optional as a ring end-effector which allows the handling of extremely warped wafers.

Features:

  • Wafer sizes: 150 mm (6”), 200 mm (8”), 300 mm (12")
  • For thin 6" and 8" wafers:  > 50 µm (1,97 mil)
  • For thin 12" wafers: > 60 µm (2,36 mil)
  • Warped wafer handling (up to 12 mm warpage)
  • Chip side handling
  • Bernoulli airflow and vacuum (edge)
  • Automated quick coupling
  • Automated loading and unloading of several mechatronic components

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