Nikon CF-NX / Wafer Bump Measureing 

 
The NWT-3000 provide automatically detect and measure 2D and 3D small height structure of parts and high accurancy without any contact by confocal optics with high throughput .Application on Bump ,LCOS,Wafer ID,MEMS ,Flip Chip,COG…
 

Overview

‧One shot height measurement of the view field

‧2D measurement of bump diameter, line width, etc.

‧Inspection for flatness or co-planarity, etc.

‧asurement by wafer-map and shot-map

‧3D view and all-focus image display

‧Combination with 12”wafer loaders

‧GEM300 full online available

‧Repeatability within FOV(2σ)0.03um



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