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XT V 160 NF (X-Ray 終極缺陷檢查系統)

The Ultimate Nanofocus X-ray System  XT V 160 NF

World-Leading feature recognition for the most demanding electronics inspection applications

 

Nikon Metrology’s brand new XT V 160 NF is a high-precision, flat-panel based X-ray inspection system that facilitates real-time imaging and defect analysis of components. 

Equipment with an in-house designed X-ray Nano focus source and high precision manipulator.

As such, the XT V160 NF is indispensable in any electronics development and production area.

 

Application

• Through Silicon Via (TSV) filling and voids

• Cu-pillar and micro-bump cold joint detection and void analysis

• BGA voids, size measurements, cold joint and head-in-pillow detection

• Bond wire analysis: ball bond, broken wire, wire sweep, stitch  bond

• QFN/QFP inspection incl. pad array analysis

Main Specification

Main body

XT V 160 NF open tube Nanofocus

kV range

30-160kV

Max. beam current

600μA

Max. tube power

20W

Min. spot size

0.3μm

Min. feature recognition

< 0.1μm up to 6W tube power

Geometric magnification

up to 2,400x

Detector

3M pixel 26 fps

Max. inspection area

510mm x 510mm

Max. board size

580mm x 580mm

Cabinet size

W: 1,819mm (excl. operator console) H: 1,998mm D: 1,728mm

Vibration isolation

Anti-vibration mounts (standard)

X-ray safety

1μSv/hr (to IRR 99)

 

  

 

 

 

 

 

 

 

 

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