Features

1.  Unattended fully automated FOUP measurement
2.  SECSII/GEM communication with Host Computer
3.  Wafer sorter function including

Profits

1)  Minimize breakage of wafers caused by dimensional errors of FOUP

2)  Low cost of ownership (Low maintenance costs)

3)  Saving of costs of 1 operator/shift

              (3 operators/year)