VMR-H3030,VMZ-R6555 + mWL300 Auto wafer measuring system
Expert of wafer warpage and Die shift measurement in Fanout process
Features
- Application in wafer bending/die shift/ bump 2D and 3D measurement/Any wafer and pattern dimension
- Fully integration with Nikon VMR-H3030/VMZ-R6555
- Handles 300/330 mm silicon and eWLB wafers
- Cleanroom compatibility
- eWLB robot arm warpage +/- 3 mm
- Wafer OCR (Option)
- SECS/GEM (Option)
- FFU (Option)
System Overview
