Wafer Bump Measureing / CF-NX
The NWT-3000 provide automatically detect and measure 2D and 3D small height structure of parts and high accurancy without any contact by confocal optics with high throughput .Application on Bump ,LCOS,Wafer ID,MEMS ,Flip Chip,COG…

Overview

•One shot height measurement of the view field

•2D measurement of bump diameter, line width, etc.

•Inspection for flatness or co-planarity, etc.

•asurement by wafer-map and shot-map

•3D view and all-focus image display

•Combination with 12”wafer loaders

•GEM300 full online available

•Repeatability within FOV（2σ）0.03um
 
聯絡資料

新竹:03-5641360
台中:04-24637816
台南:06-5891721
E-Mail:sylvia_lee@ticgroup.com.tw