Auto Bavel Inspection / WES-3000 The WES-3000 edge and bevel inspection system provide very high throughput and high resolution by improving defect detectability ,suitable for In-Line process and analysis. Overview ◎High Speed Inspection The WES-3000 achieves an industry-leading throughput of 100 WPH*. Inspection on whole 360 degrees covering Upper Bevel, Apex and Lower Bevel of a wafer edge. ◎High Stability Hardware with High Performance High-speed and stable inspection with image capturing is always available thanks to the high precision alignment wafer stage system. ◎High Sensitivity The WES-3000 enables defect detection with a resolution of 4μm while maintaining high-speed inspection. ◎Wide Inspection Area High-speed inspection covers 5mm from wafer edge. ◎High Resolution Review Image Defects detected by high-speed inspection can be reviewed by clear color with high resolution review with 1μm resolution. ◎User-Friendly Operation The WES-3000 control panel and GUI enable simple and intuitive operation. ◎Various Applications and Functions Various applications and functions support classification and analysis on detected defects. The WES-3000 contributes to improve process yield through the early detection and identification of wafer edge defects.   聯絡資料 新竹:03-5641360 台中:04-24637816 台南:06-5891721 E-Mail:sylvia_lee@ticgroup.com.tw