The pre-aligners provide alignment for 150 mm (6") up to 300 mm (12") wafers. They center the wafer, find the precise orientation of its notch or flat and align it exactly.

Due to “vacuum handshake” between end-effector and pre-aligner the wafer is always secure with a minimal touch at the wafer back side. Several mechatronic end-effectors can be used for loading and unloading of a pre-aligner.


  • Wafer sizes: 150 mm (6"), 200 mm (8") and 300 mm (12")
  • Wafer thickness: > 50 µm (1,97 mil)
  • eWLB wafer handling possible
  • Centering of wafers
  • Alignment of notch/flat
  • Digital vacuum sensors and "vacuum handshake"
  • OCR reader for wafer ID optional
  • Cleanroom class 4 (ISO EN 14 644-1)
  • SEMI standards compliant

Product Images

mechatronic Pre-aligner mPA 150/200 for 6

Product Datasheets


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