XT V 160 NF (X-Ray 終極缺陷檢查系統)
The Ultimate Nanofocus X-ray System XT V 160 NF
World-Leading feature recognition for the most demanding electronics inspection applications
Nikon Metrology’s brand new XT V 160 NF is a high-precision, flat-panel based X-ray inspection system that facilitates real-time imaging and defect analysis of components.
Equipment with an in-house designed X-ray Nano focus source and high precision manipulator.
As such, the XT V160 NF is indispensable in any electronics development and production area.
Application
• Through Silicon Via (TSV) filling and voids
• Cu-pillar and micro-bump cold joint detection and void analysis
• BGA voids, size measurements, cold joint and head-in-pillow detection
• Bond wire analysis: ball bond, broken wire, wire sweep, stitch bond
• QFN/QFP inspection incl. pad array analysis
Main Specification
Main body | XT V 160 NF open tube Nanofocus |
kV range | 30-160kV |
Max. beam current | 600μA |
Max. tube power | 20W |
Min. spot size | 0.3μm |
Min. feature recognition | < 0.1μm up to 6W tube power |
Geometric magnification | up to 2,400x |
Detector | 3M pixel 26 fps |
Max. inspection area | 510mm x 510mm |
Max. board size | 580mm x 580mm |
Cabinet size | W: 1,819mm (excl. operator console) H: 1,998mm D: 1,728mm |
Vibration isolation | Anti-vibration mounts (standard) |
X-ray safety | 1μSv/hr (to IRR 99) |